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  • 线路板UL认证软板UL认证铝基板UL认证

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  • 认证机构类别:认证培训机构
    认证服务类别:产品认证
  •  (一) FR-4,FR-4.1,FR-5单面板及双面板认证申请
    (二) cem-1,cem-3单面板及双面板申请
    (三) FR-1,FR-3单面板及双面板申请
    (四) FR-4多层板申请
    (五) 单面铝基板仅燃烧认证和全认证申请
    (六) 双面铝基板仅燃烧认证和全认证申请
    (七) 多层铝基板仅燃烧认证和全认证申请
    (八) 铜基板 单面,双面,多层  仅燃烧认证和全认证申请
    (九) 柔性线路板(软板)仅燃烧认证和全认证申请
    (十) 软硬结合板仅燃烧认证和全认证申请
    (十一) 线路板基材认证申请
    (十二) 线路板油墨认证申请
    (十三) 覆盖膜,电磁膜,屏蔽膜认证申请
    (十四) 已有UL,增加CUL认证申请
    (十五) 其他认证申请
    (十六) XPC板材 22f板材 HB板材 V0板材
    1 Scope

    1.1 These requirements apply to rigid printed-wiring boards and flexible printed-wiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation.

    1.2 The flexible printed-wiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a cover-lay film, with midboard connections.

    1.3 These requirements do not cover flexible printed-wiring boards of laminated-film construction in which the conductors are parallel to each other and are completely covered by the base film with only point-to-point end connections.

    1.4 These requirements do not apply to flexible, flex-to-install, rigid, and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials as flexible materials interconnect constructions (FMIC's) for use as components in devices or appliances – that are covered by the Standard for Flexible Materials Interconnect Constructions, UL 796F.
    Cover
    Transmittal
    Table of Contents
    Body
    INTRODUCTION
    1 Scope
    2 Glossary
    3 Units of Measurement
    4 Measurement Accuracy and Testing Conditions
    5 Supplementary Test Procedures
    6 References
    7 General
    CONSTRUCTION
    8 General
    9 base Materials
    10 Conductors
    11 Adhesives for Conductor Bonding
    12 Processes
    13 Permanent Coatings
    14 Plugged-Hole Materials
    15 Embedded Components
    16 Singlelayer (Singlesided and doublesided) Printed-Wiring Boards
    17 Multilayer Printed-Wiring Boards
    18 metal base Printed-Wiring Boards
    19 Flexible Printed-Wiring Boards
    20 Variations In Printed-Wiring Board Construction
    PERFORMANCE
    21 Test Samples
    22 Data Collection
    23 Microsection Analysis
    24 Thermal Shock
    25 Flammability
    26 Bond Strength
    27 Delamination and Blistering
    28 Dissimilar Dielectric Materials Thermal Cycling Test
    29 Plating Adhesion
    30 Conductive Paste Adhesion Test
    31 Dielectric Materials Intended for Use in Fabricating High Density Interconnect (HDI) Type Constructions
    32 Silver Migration Test
    MARKINGS
    33 General

    FOLLOW-UP INSPECTION

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    详询Sunny 陶13913142465 QQ1822971259


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